Soldering Pastes

Product Details:

Heraeus offers a full line of no clean, solvent clean and water soluble pastes. These lead & lead free pastes provide industry leading wetting and outstanding void performance on a variety of component termination and surfaces. The products feature wide process windows which reduces processing cost significantly, makes set up easy and saves time.

Product Details:

Typical application

Mainly used for STM bonding components.

Recommend cure condition:120 90-120s or 150 60-0s

Heat-resisting strength

(sample curing at 150 30min
AL/AL shear strength under appropriate temperature test

Store 2~8 dry sealed storage, shelf life is 6 months.

Higher curing temperatures and longer curing time will get a better bond strength The curves for the recommended curing temperature and heating rate, show when the components reach a good adhesion needs time at the corresponding temperature. Users can set the oven temperature according the curing curves and oven efficiency

Product Details:

Lead Free Low temperature solder paste is specifically design with a rosin base paste flux or Lead free solder paste processes.