Product Details:
Minimum Order Quantity | 10 Kg |
Physical State | Solid |
Brand | Electroloy |
Usage/Application | Wire |
Model Name/Number | EMCO265HF-318P |
Lot No. | Sp1711006 |
Alloy | Sn98.5Ag1Cu0.5 |
Size | 45 mu m |
Flux | 11.5% |
Product Details:
Physical State | Solid |
Brand | Glenx |
Packaging Size | 1 Kg |
Usage/Application | SMD Solder Paste |
Country of Origin | Made in India |
Automation Grade | Manual |
Packaging Type | Bucket |
Product Details:
Grade Standard | Industrial Grade |
Packaging Size | 5 L |
Packaging Type | Bottle |
Surface Of Application | Plastic |
Country of Origin | Made in India |
Color | Red |
Shape | Cylindrical |
Typical application
Mainly used for STM bonding components.
(sample curing at 150 30min
AL/AL shear strength under appropriate temperature test
Store 2~8 dry sealed storage, shelf life is 6 months.
Higher curing temperatures and longer curing time will get a better bond strength The curves for the recommended curing temperature and heating rate, show when the components reach a good adhesion needs time at the corresponding temperature. Users can set the oven temperature according the curing curves and oven efficiency